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US 2011/0214911 A1Published application
Circuit system with leads and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsSeng Guan Chow, Heap Hoe Kuan, Reza Argenty Pagaila
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Abstract
A method of manufacture of a circuit system includes: providing a carrier base; forming a cavity in the carrier base; forming a bridge lead over the cavity, the bridge lead exposing the cavity; and mounting a device having an anchor interconnect, the anchor interconnect is in the cavity and conformal to the bridge lead over the cavity.
Claims20
A method of manufacture of a circuit system comprising:
- providing a carrier base;
- forming a cavity in the carrier base;
- forming a bridge lead over the cavity, the bridge lead exposing the cavity;
- and
- mounting a device having an anchor interconnect, the anchor interconnect is in the cavity and conformal to the bridge lead over the cavity.
2 more elements
A method of manufacture of a circuit system comprising:
- providing a carrier base;
- forming a cavity in the carrier base;
- forming a bridge lead over the cavity, the bridge lead exposing the cavity;
- mounting a device having an anchor interconnect, the anchor interconnect is in the cavity and conformal to the bridge lead over the cavity;
- and
- forming an encapsulation between the device and the carrier base and covering the anchor interconnect and the bridge lead.
3 more elements
A circuit system comprising:
- a carrier having a cavity;
- a bridge lead over the cavity, the bridge lead exposing the cavity;
- and
- a device having an anchoring interconnect over the carrier, the anchor interconnect in the cavity and conformal to the bridge lead over the cavity.
1 more element
Dependencies are inferred from the claim text.