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US 2011/0214904 A1Published application
Heat Sink, Cooling Module And Coolable Electronic Board
AssigneeFuchigami Micro Co., Ltd.
InventorsKenji Ohsawa, Katsuya Tsuruta, Toshiaki Kotani, Kei Mizuta
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Abstract
A heatsink is provided with a base body opposed to a heat generating body and absorbing heat from the heat generating body. Thermal resistance of that opposed portion of the base body which is opposed to the heat generating body is higher than thermal resistance of a surrounding portion surrounding the opposed portion.
Claims14
A heat sink comprising:
- a base that faces a heat-generating body and absorbs heat from the heat-generating body;
- wherein, in the base, the thermal resistance of a facing portion which faces the heat-generating body is higher than the thermal resistance of a surrounding portion which surrounds the facing portion.
A cooling module, comprising:
- a flat plate-shaped base that has a heat-receiving surface and a heat-radiating surface;
- and
- a flat plate-shaped heat pipe disposed facing said heat-receiving surface;
- wherein:
- in the base, the thermal resistance of a facing portion which faces the flat plate-shaped heat pipe is higher than the thermal resistance of a surrounding portion which surrounds the facing portion;
- and
- the flat plate-shaped heat pipe cools a heat-generating body by means of the evaporation and condensation of a coolant sealed inside.
4 more elements
A coolable electronic board comprising:
- an electronic board;
- an electronic component having the property of generating heat which is mounted upon the electronic board;
- and
- a cooling module which is disposed facing the electronic component.
1 more element
Dependencies are inferred from the claim text.