Insulation resin composition resistant to thermal deformation and cable using the same
AssigneeLS Cable Ltd.
InventorsMin-Su JUNG, Jin-Ho Nam, Ung Kim
Life of this patent
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Abstract
Disclosed is an insulation resin composition resistant to thermal deformation comprising an ethylene copolymer base resin having crystallinity between 1% and 30%, not including 30%; and 0.5 to 20 parts by weight of an organic peroxide-based crosslinking agent per 100 parts by weight of the base resin, and a cable using the same. The insulation is resistant to thermal deformation that may occur after a crosslinking process under high temperature and high pressure subsequently to extrusion of a sheath.
Claims8
An insulation resin composition resistant to thermal deformation, comprising:
- a base resin comprising an ethylene copolymer having crystallinity less than 30%;
- and
- 0.5 to 20 parts by weight of an organic peroxide-based crosslinking agent per 100 parts by weight of the base resin.
The cable according to claim 7, wherein the insulation has a tensile strength of 12.5 N/m2 or more and an elongation of 250% or more at room temperature, and a hardness of 90 or less using a Shore A hardness scale.
Dependencies are inferred from the claim text.