Heat conductive dielectric polymer material and heat dissipation substrate containing the same

A solventless melt-shapeable thermally curable heat conductive dielectric polymer material, comprising:

• a polymer mixture comprising a thermoplastic and a thermosetting epoxy resin, wherein the thermoplastic comprises 3% to 30% by volume of the polymer mixture;
• and the thermoplastic and thermosetting epoxy resin are mutually soluble;
• and the thermosetting epoxy resin is selected from the group consisting of end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-function group epoxy resin and the mixture thereof;
• and the thermoplastic is selected from hydroxy phenoxy ether polymer, hydroxyl ester ether polymer, hydroxyl amino ether polymer, and the mixture thereof.
• a curing agent operable to cure the thermosetting epoxy resin at a curing temperature;
• and
• a heat conductive filler uniformly distributed in the polymer;
• comprising 40% to 70% by volume of the heat conductive dielectric polymer material;
• wherein the heat conductive dielectric polymer material has an interpenetrating structure, which is melt-shapeable at the temperature from 25° C. to 100° C. and can be thermally crosslinked at an elevated temperature above 125° C., and a heat conductive coefficient greater than 1.0 W/m-K.