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US 2011/0214851 A1Published application
Use of a graphite heat-dissipation device including a plating metal layer
AssigneeWah Hong Industrial Corp.
InventorsKo-Chun CHEN, Chiu-Lang LIN
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Abstract
The present invention relates to a heat-dissipating device for an electronic device, comprising a graphite planar body, one or more metal layers, an insulation film and an adhesive. The heat-dissipating device is optionally attached to a heat sink. The method of using the heat-dissipating device to dissipate heat is also disclosed.
Claims17
A heat-dissipating device, comprising
- a planar body comprising graphite, wherein one or more surfaces of the planar body are electroplated with one or more metal layers;
- and
- an adhesive adhered to the non-electroplated surface of the planar body.
A heat-dissipating device, comprising
- a planar body comprising graphite, wherein one or more surfaces of the planar body is electroplated with one or more metal layers;
- and
- an adhesive adhered to the metal layer, wherein said metal layer is interposed between the adhesive and the planar body.
A heat-dissipating device for dissipating heat in an electronic device, comprising:
- a. means for dissipating the heat;
- b. means for providing mechanical strength;
- c. means for preventing graphite flaking;
- d. means for attaching to the electronic device;
- and
- e. means for providing electrical insulation.
3 more elements
A method for dissipating heat in an electronic device, comprising the steps of:
- a. placing a heat-dissipating device with a planar body and one or more metal layers in contact with a heat source in an electronic device;
- b conducting heat from the heat source to the metal layer;
- and
- c. conducting the heat from the metal layer to the planar body .
1 more element
A heat-dissipation device, comprising:
- a metal panel;
- and
- one or more planar body comprises of graphite, wherein at least one surface of the planar body is electroplated with one or more metal layers.
Dependencies are inferred from the claim text.