US 2011/0214843 A1 · Systems and Methods for Thermal Control of Integrated Circuits During Testing

Abstract

Thermal control units (TCU) for maintaining a set point temperature on an IC device under test (DUT) are provided. The units include a pedestal assembly comprising a heat-conductive pedestal, a fluid circulation block, a thermoelectric module (Peltier device) between the heat-conductive pedestal and the block for controlling heat flow between the pedestal and fluid circulation block, and a force distribution block for controllably distributing a z-axis force between different pushers of the TCU. Alternatively, instead of a thermoelectric module, a heater can provide heat to the DUT. Optionally, a swivelable temperature-control fluid inlet and outlet arms may be provided to reduce instability of the thermal control unit due to external forces exerted on the TCU such as by fluid lines attached to the fluid inlet and outlet arms. Also optionally, an integrated means for abating condensation on surfaces of the TCU during cold tests may be provided.

Claims16

Dependent claims

A thermal control unit for maintaining a set point temperature on an IC device under test (DUT) having a substrate having a die attached to an upper surface thereof, comprising:

a pedestal assembly comprising a heat-conductive pedestal having a bottom end configured to contact the die of the DUT and a temperature sensor in the bottom end for monitoring the die's temperature;
a temperature-control fluid circulation block having a fluid inlet and a fluid outlet configured to circulate a fluid therethrough, the block in stacked relationship along an z-axis with the heat conductive pedestal;
a thermally-conductive heater between the heat-conductive pedestal and the fluid circulation block configured to provide heat to the pedestal, and further configured to transfer heat from the pedestal to the fluid circulation block;
a substrate pusher configured to contact the substrate of the DUT;
and
a controllable force distributor configured to receive a z-axis force and controllably distribute such z-axis force between the pedestal assembly and the substrate pusher.

3 more elements

Dependencies are inferred from the claim text.

Systems and Methods for Thermal Control of Integrated Circuits During Testing

Life of this patent

Systems and Methods for Thermal Control of Integrated Circuits During Testing

Life of this patent

Abstract

Claims16