Boiling heat transfer device
AssigneeNEC Corporation
InventorsHitoshi Sakamoto, Minoru Yoshikawa, Takeya Hashiguchi
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AssigneeNEC Corporation
InventorsHitoshi Sakamoto, Minoru Yoshikawa, Takeya Hashiguchi
Estimating the term…
A boiling heat transfer device of the present invention includes: a heat receiving portion that boils a liquefied refrigerant to convert it to vapor, and contacts with a device to be cooled and cools the device to be cooled; a vapor tube that connects to an upper portion of the heat receiving portion and conveys the vapor generated by the heat receiving portion; a heat dissipating portion that condenses the vapor conveyed from the vapor tube to convert it to a liquefied refrigerant and dissipates heat to an atmosphere; and a liquid tube that returns to the heat receiving portion the liquefied refrigerant condensed by the heat dissipating portion. At least a portion of a cross-sectional area of a flow passage of the vapor in the heat receiving portion gradually decreases from a lower portion of the heat receiving portion toward the upper portion of the heat receiving portion.
A boiling heat transfer device comprising:
A boiling heat transfer device comprising:
A boiling heat transfer device comprising:
Dependencies are inferred from the claim text.