Plasma processing apparatus and shower head
AssigneeTokyo Electron Limited
InventorsHachishiro Iizuka, Jun Abe, Akihiro Yokota, Takeshi Ohse
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AssigneeTokyo Electron Limited
InventorsHachishiro Iizuka, Jun Abe, Akihiro Yokota, Takeshi Ohse
Estimating the term…
There is provided a plasma processing apparatus including: a shower head installed within a processing chamber for processing a substrate and facing a mounting table for mounting the substrate; a multiple number of gas exhaust holes formed through the shower head to be extended from a facing surface of the shower head to an opposite surface to the facing surface; a multiple number of openable and closable trigger holes formed through the shower head to be extended from the facing surface of the shower head to the opposite surface, and configured to allow plasma leakage from the facing surface to the opposite surface; and a partition wall installed in a gas exhaust space provided on the side of the opposite surface of the shower head to divide the gas exhaust space into a multiple number of regions, each region communicating with one or more trigger holes.
A plasma processing apparatus comprising:
A shower head that is installed in a processing chamber for processing a substrate therein so as to face a mounting table for mounting the substrate thereon, and supplies a gas toward the substrate in a shower pattern through a plurality of gas discharge holes provided in a facing surface of the shower head facing the mounting table, the shower head comprising:
Dependencies are inferred from the claim text.