Bonding apparatus and bonding method

A bonding method of bonding two members to each other by using a bonding apparatus, the bonding apparatus comprising:

• a first holding section which places and holds a first member on an upper surface thereof;
• a second holding section which is formed above and facing the first holding section and holds a second member on a lower surface thereof;
• and
• an intake mechanism which sucks atmosphere between the first holding section and the second holding section,
• wherein the second holding section is an elastic body, a portion of which bends due to a predetermined pressure,
• the bonding method comprising:
• disposing the first holding section and the second holding section so that a vertical distance between the first holding section and the second holding section becomes a predetermined distance;
• intaking atmosphere between the first holding section and the second holding section so that a portion of the second holding section which holds the second member bends and the bent portion of the second member abuts on the first member;
• and
• further intaking the atmosphere between the first holding section and the second holding section so that an entire surface of the second member is bonded to an entire surface of the first member.