Apparatus and method for fabricating bonded substrate
AssigneeFujitsu Limited
InventorsTakanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Abstract
A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
Claims7
A method for bonding two substrates held by first and second holding plates facing each other and arranged in a process chamber, the method comprising:
- chucking an outer surface of a selected one of the two substrates and holding the substrate in a horizontal state by a holding member while carrying the substrate in the process chamber;
- and
- housing the holding member in a channel formed in at least one of the first and second holding plates when transferring the substrate held by the holding member to the at least one of the first and second holding plates.
A method for bonding two substrates held by first and second holding plates facing each other and arranged in a process chamber, the method comprising:
- chucking an outer surface of a selected one of the two substrates and holding the substrate in a horizontal state by a holding member;
- placing the selected one of the substrates close to at least one of the first and second holding plates;
- and
- holding the selected one of the substrates by said at least one of the first and second holding plates while housing the holding member in a channel formed in said at least one of the first and second holding plates.
A method for bonding upper and lower substrates respectively held by first and second holding plates facing each other and arranged in a process chamber, the method comprising:
- chucking an outer surface of the upper substrate or the lower substrate and holding the substrate in a horizontal state by a first transfer arm while carrying the substrate in the process chamber;
- and
- holding a bonded substrate of the upper and lower substrates in a horizontal state by a second transfer arm while carrying the bonded substrate out of the process chamber.
Dependencies are inferred from the claim text.