Epitaxial Lift Off Systems and Methods
AssigneeAlta Devices, Inc.
InventorsBrian BROWN, Brian BURROWS, David BERKSTRESSER, Gang HE, Thomas J. GMITTER
Life of this patent
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Abstract
Epitaxial lift off systems and methods are presented. In one embodiment a tape is disposed on the opposite side of the epitaxial material than the substrate is used to hold the epitaxial material during the etching and removal steps of the ELO process. In various embodiments, the apparatus for removing the ELO film from the substrates without damaging the ELO film may include an etchant reservoir, substrate handling and tape handling mechanisms, including mechanisms to manipulate (e.g., cause tension, peel, widen the etch gap, etc.) the lift off component during the lift off process.
Claims20
A system comprising:
- an etchant application component configured to apply etchant to a sacrificial layer between an epitaxial lift off component and a growth substrate;
- a separation assistance component configured to manipulate the epitaxial lift off component to assist separation of the epitaxial lift off component from the substrate, wherein manipulation of the epitaxial lift off component is controlled to facilitate exposure of an etchant to an etch face of the sacrificial etch layer;
- and
- a tape application component configured to couple the epitaxial lift off component to a tape, wherein the tape assists the manipulation and transportation of the epitaxial lift off component while etchant is applied to the sacrificial layer.
An epitaxial lift off method comprising:
- receiving a wafer, wherein the wafer includes a substrate, a sacrificial etch layer and an epitaxial lift off component;
- coupling the wafer to a tape;
- exposing the sacrificial etch layer to an etchant;
- and
- manipulating the epitaxial lift off component while the sacrificial etch layer is exposed to the etchant, wherein the manipulating is controlled to assist separation of the epitaxial lift off component from the substrate prior to final separation of the lift off component and the substrate.
An epitaxial lift off system comprising:
- a wafer receiving stage wherein the wafer includes a substrate, a sacrificial etch layer and an epitaxial lift off component;
- a tape coupling application stage, wherein the epitaxial lift off component is coupled to a tape;
- an etching stage wherein the lift off component is manipulated to assist etchant exposure to an etch face of the sacrificial etch layer and aid separation of the epitaxial lift off component from the substrate.
Dependencies are inferred from the claim text.