Supercritical processing apparatus and supercritical processing method
AssigneeTokyo Electron Limited
InventorsTakayuki TOSHIMA, Mitsuaki IWASHITA, Kazuyuki MITSUOKA, Hidekazu OKAMOTO, Hideo NAMATSU
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AssigneeTokyo Electron Limited
InventorsTakayuki TOSHIMA, Mitsuaki IWASHITA, Kazuyuki MITSUOKA, Hidekazu OKAMOTO, Hideo NAMATSU
Estimating the term…
Disclosed is a supercritical processing apparatus and a supercritical processing method for suppressing the pattern collapse or the injection of material constituting a processing liquid into a substrate. A processing chamber receives a substrate subjected to a processing with supercritical fluid, and a liquid supply unit supplies a processing liquid including a fluorine compound to the processing chamber. A liquid discharge unit discharges the supercritical fluid from the processing chamber, a pyrolysis ingredient removing unit removes an ingredient facilitating the pyrolysis of a liquid from the processing chamber or from the liquid supplied from the liquid supply unit, and a to heating unit heats the processing liquid including a fluorine compound of hydrofluoro ether or hydrofluoro carbon.
A supercritical processing apparatus, comprising:
A supercritical processing method, comprising:
Dependencies are inferred from the claim text.