Head nozzle unit, and apparatus and method for mounting electronic parts

An apparatus for mounting electronic parts, comprising:

• a body having a part feeding region to which the electronic parts are fed, and a part mounting region which is spaced apart from the part feeding region by a predetermined distance to hold a board on which the electronic parts are mounted;
• and
• a head nozzle unit disposed above the body and including a pair of head nozzle parts that are reciprocated between the part feeding region and the part mounting region to pick up the electronic parts and to mount the electronic parts on the board.

A method of mounting electronic parts, comprising:

• disposing a pair of head nozzle parts above a part feeding region and a part mounting region, the pair of head nozzle parts located on opposite lateral surfaces of a guide member connecting an upper portion of the part feeding region and an upper portion of the part mounting region, each of the head nozzle parts picking up the electronic parts using vacuum suction in the part feeding region and mounting the picked up electronic parts on a board in the part mounting region;
• and
• alternately reciprocating the pair of head nozzle parts along the guide member between the part feeding region and the part mounting region to pick up the electronic parts using vacuum suction and mount the electronic parts on the board.