Highly conductive composites
AssigneePixelligent Technologies, LLC
InventorsWei Xu, Jun Xu, Zehra Serpil Gonen-Williams, Gregory D. Cooper
Life of this patent
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Abstract
Domain segregation of polymer blends or block copolymers in the presence of thermal conducting high aspect ratio nanocrystals leads to preferential placement of conductive filler either inside one domain, which promote the self-assembly of a thermal and/or electrical conducting pathway composed of high aspect ratio filler. The self-assembly of such thermal and/or electrical conducting pathway effectively enhances the thermal and/or electrical conductivity of the composite with significantly less amount of filler.
Claims37
A multi-component material for thermal conduction, comprising:
- a first component comprising a polymer matrix;
- a second component comprising a low melting point material immiscible with the first component;
- and
- a third component comprising a filler material with higher thermal conductivity than the first and second components;
- wherein the third component is dispersed into the second component and the second component is dispersed within the polymer matrix.
A process of making a multi-component material, comprising:
- providing a polymeric matrix material and a low melting point material;
- capping filler particles with capping agents immiscible with the polymeric matrix material and miscible in the low melting point material to provide capped filler particles;
- dispersing the capped filler particles in the low melting point material;
- creating a mixture by combining the polymeric matrix and the low melting point material including the dispersed, capped filler particles;
- and
- forming a multi-component material from the mixture.
A process of making a multi-component fluid for use in manufacturing thermally enhanced layers, comprising:
- providing a polymeric matrix material and a low melting point material;
- capping filler particles with capping agents immiscible with the polymeric matrix material and miscible in the low melting point material to provide capped filler particles;
- dispersing the capped filler particles in the low melting point material;
- and
- creating a mixture by combining the polymeric matrix and the low melting point material including the dispersed, capped filler particles.
A product formed by the process of:
- providing a polymeric matrix material and a low melting point material;
- capping filler particles with capping agents immiscible with the polymeric matrix material and miscible in the low melting point material;
- dispersing capped filler particles in the low melting point material;
- and
- creating a mixture by combining the polymeric matrix and the low melting point material including the dispersed, capped filler particles.
A process for assembling a system having enhanced thermal conductivity, comprising:
- Providing an integrated circuit and a heat sink;
- and
- Forming a multi-component thermal conductor therebetween, wherein the multi-component thermal conductor comprises a matrix material with a second phase material comprising filler material dispersed therein.
A transparent multi-component electrical conductor, comprising:
- a first component comprising a optically transparent matrix polymer;
- a second component comprising an optically transparent, low melting point material immiscible with the first component;
- and
- a third component comprising a filler material with higher electrical conductivity than the first and second components;
- wherein the third component is dispersed into the second component and the second component is dispersed within the polymer matrix and wherein the third component provides enhanced electrical conductivity to the multi-component electrical conductor.
A method of inducing alignment of high aspect ratio filler along the heat and/or electricity conduction direction comprising:
- applying an external electric and/or magnetic field, and
- self aligning due to geometric confinement of fillers in the second phase material at least in part in response to said field.
A multi-component material for electrical conduction, comprising:
- a first component comprising a matrix polymer;
- a second component comprising a low melting point material immiscible with the first component;
- and
- a third component comprising a filler material with higher thermal conductivity than the first and second components;
- wherein the third component is dispersed into the second component and the second component is dispersed within the polymer matrix.
A multi-component material for thermal conduction, comprising:
- a polymer matrix;
- a low melting point material immiscible with the polymer matrix;
- and
- a filler material with higher thermal conductivity than the polymer matrix and the low melting point material;
- wherein the filler material is dispersed into the low melting point material and the low melting point material is dispersed within the polymer matrix.
Dependencies are inferred from the claim text.