Actuator for maintaining alignment of die detachment tools

A die ejector for a die detachment apparatus for detaching a die from an adhesive tape on which the die is mounted, the die detachment apparatus including a pick-and-place tool movable along a pick-up axis for picking up the die from the adhesive tape, the die ejector comprising:

• an ejector shaft including an ejector pin which is movable parallel to the pick-up axis to raise the die from the adhesive tape on which the die is mounted to facilitate pick-up of the die from the adhesive tape by the pick-and-place tool;
• a positioning device having at least one movable table to which the ejector shaft is operatively coupled, the positioning device further comprising at least one piezoelectric actuator;
• and
• at least one flexure connecting the piezoelectric actuator and the movable table, the flexure being operatively responsive to actuation by the piezoelectric actuator to force the movable table and ejector shaft to move in directions which are perpendicular to the pick-up axis for alignment of the ejector pin with the die pick-up tool along the pick-up axis.