Method of manufacturing package, package, piezoelectric vibrator, oscillator, electronic apparatus, and radio-controlled timepiece
OwnerMasashi Numata, Hiroshi Higuchiinventors
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Abstract
Provided are a package manufacturing method capable of hot-molding a substrate into a desired shape, and a package and a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator. A molding step is a step in which in a penetration hole forming step, through-holes are formed by pressing and heating a base substrate wafer with a through-hole forming mold having convex portions corresponding to the through-holes. The through-hole forming mold is formed of a material having an open porosity equal to or larger than 14%.
Claims16
A method for producing piezoelectric vibrators, comprising:
- (a) defining a plurality of first substrates on a first wafer and a plurality of second substrates on a second wafer;
- (b) forming a pair of holes in a respective at least some of the first substrates on the first wafer;
- (c) placing a conductive rivet in a respective at least some of the holes;
- (d) press-fusing the first wafer in a mold to hermetically closing the at least some of the holes with the conductive rivet therein, wherein the mold has at least one of the following physical properties:
- (i) an open porosity equal to or larger than about 14%;
- and
- (ii) a thermal expansion coefficient equal to or larger than about 4 ppm/° C.;
- (e) hermetically bonding the first and second wafers such that at least some of the first substrates substantially coincide respectively with at least some of the corresponding second substrates, wherein a piezoelectric vibrating strip is secured in a respective pairs of at least some of coinciding first and second substrates;
- and
- (f) cutting off cutting off a respective at least some of packages made of coinciding first and second substrates.
A molding die for pressing a glass wafer inside, having at least one of the following physical properties:
- (i) an open porosity equal to or larger than about 14%;
- and
- (ii) a thermal expansion coefficient equal to or larger than about 4 ppm/° C.
Dependencies are inferred from the claim text.