Gluconic acid containing photoresist cleaning composition for multi-metal device processing

A semi-aqueous, alkaline cleaning composition for cleaning a multi-metal microelectronic device, the composition consisting of:

• (a) from about 10% to about 35% water;
• (b) from about 5% to about 15% of at least one alkanolamine;
• (c) from about 10% to about 50% solvent selected from the group consisting of N-methylpyrrolidinone or a mixture of N-methylpyrrolidinone and sulfolane;
• (d) from about 2% to about 10% of gluconic acid or a compound producing gluconic acid by hydrolysis in water;
• (e) from about 1% to about 8% of at least one oligoethylene glycol of the formula HO(CH2CH2O)nCH2CH2OH wherein n is 1 or more;
• and
• (f) optionally from about 10% to about 40% of at least one diethylene glycol monoalkyl ether wherein the alkyl group contains from 1 to 4 carbon atoms;
• wherein the percentages are weight percent based on the total weight of the composition and when the percentage of alkanolamine is equal to or less than 6% the amount of N-methylpyrrolidinone solvent in the composition is 20% or more, and when the percentage of alkanolamine is 9% or more the amount on N-methyl pyrrolidinone may be equal to or less than 20%.