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US 2011/0212823 A1Published application
Ceramic shaped body and wiring board
AssigneeSeiko Epson Corporation
InventorsKentaro TANABE, Atsushi DENDA, Toshiyuki KOBAYASHI, Yoshikazu HAMA, Naoyuki TOYODA
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Abstract
A ceramic shaped body for producing a wiring board includes a ceramic material, a binder, and a polyalcohol, the polyalcohol being present in at least a near-surface region of the ceramic shaped body.
Claims9
A ceramic shaped body for producing a wiring board, comprising a ceramic material, a binder, and a polyalcohol, the polyalcohol being present in at least a near-surface region of the ceramic shaped body.
Dependencies are inferred from the claim text.