High density electrical connector and pcb footprint
AssigneeAmphenol Corporation
InventorsPhilip T. Stokoe, Mark W. Gailus, Huilin Ren, Donald A. Girard, JR.
Life of this patent
Estimating the term…
Loading patent…
AssigneeAmphenol Corporation
InventorsPhilip T. Stokoe, Mark W. Gailus, Huilin Ren, Donald A. Girard, JR.
Estimating the term…
An interconnection system that includes a daughter card and backplane electrical connectors, each mounted to a printed circuit board at a connector footprint. The backplane connector has conductive elements with transition regions that allow the mating contact portions to be positioned on a uniform pitch while contact tail portions can be shaped to improve signal integrity or to provide a more compact and/or mechanically robust footprint. The conductive elements in both connectors are configured such that the contact tails of the ground conductors align from column to column, but the planar portions of the ground conductors in one column align with a pair of signal conductors in the other column, which improves mechanical and signal integrity. Mechanical integrity may be improved by forming the connector footprints with pads for the ground conductors that span multiple columns.
A printed circuit board comprising a component footprint, the component footprint comprising:
The printed circuit board of claim Sin combination with an electrical connector, the electrical connector comprising a plurality of subassemblies, each subassembly comprising a plurality of surface mount contact tails aligned with a corresponding column of the connector footprint, each surface mount contact tail being soldered to a pad of the plurality of pads in the corresponding column or to a stripe of the conductive region at allocation in the corresponding column, wherein:
A connector comprising:
A printed circuit board comprising a component footprint, the component footprint comprising:
Dependencies are inferred from the claim text.