Back to results
US 2011/0212622 A1Published application
Surface texturing using a low quality dielectric layer
AssigneeInternational Business Machines Corporation
InventorsJoel P. Desouza, Harold J. Hovel, Daniel Inns, Jeehwan Kim, Devendra K. Sadana, Katherine L. Saenger
Life of this patent
Estimating the term…
Abstract
A low cost method is described for forming a textured Si surface such as for a solar cell which includes forming a dielectric layer containing pinholes, anisotropically etching through the pinholes to form inverted pyramids in the Si surface and removing the dielectric layer thereby producing a high light trapping efficiency for incident radiation.
Claims11
A method for forming a textured surface on a Si containing substrate comprising:
- forming a dielectric layer on said surface having a plurality of pinholes through said dielectric layer;
- anisotropic etching said surface through said pinholes to form inverted pyramid patterns;
- and
- removing said dielectric layer to expose said textured surface of inverted pyramid patterns.
1 more element
Dependencies are inferred from the claim text.