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US 2011/0212555 A1Published application
Flexible substrate with electronic devices and traces
AssigneeEastman Kodak Company
InventorsTimothy J. Tredwell, Roger S. Kerr
Life of this patent
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Abstract
A method of manufacturing an electronic device (10) provides a substrate (20) that has a plastic material and has a metallic coating on one surface. A portion of the metallic coating is etched to form a patterned metallic coating. A particulate material (16) is embedded in at least one surface of the substrate. A layer of thin-film semiconductor material is deposited onto the substrate (20).
Claims12
A method of manufacturing an electronic device comprising:
- a) providing a substrate that comprises at least one plastic material;
- b) forming a pattern on at least one surface of said substrate;
- c) embedding a particulate material into the at least one surface of said substrate;
- d) applying a planarization material to the surface of the substrate having the embedded particulate material, forming a planarization layer thereby;
- e) forming a thin film electronic device on said surface with said particulate material;
- and
- f) forming a patterned trace layer on the surface of the substrate that lies opposite the surface having the embedded particulate material.
4 more elements
A method of manufacturing an electronic device comprising:
- a) providing a substrate that comprises at least one plastic material having a metallic coating on one surface;
- b) forming a trace pattern by etching the metallic coating;
- c) applying a planarization material to an opposite surface of the substrate, forming a planarization layer thereby;
- d) forming a thin film electronic device on said surface with said particulate material;
- and
- e) forming a via connecting the thin-film electronic device with a portion of the trace pattern.
3 more elements
Dependencies are inferred from the claim text.