Apparatus and method for predetermined component placement to a target platform
AssigneeWintec Industries, Inc.
InventorKong C. Chen
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Abstract
The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.
Claims20
A method of aligning electrical contacts of a second electronic circuit or assembly with electrical contacts of a first electronic circuit or assembly, the second electronic circuit or assembly and the first electronic circuit or assembly each being provided with one or more alignment features, the method comprising:
- placing electrical contacts of the second electronic circuit or assembly in contact or near contact with electrical contacts of the first electronic circuit or assembly;
- and
- during said contact or near contact, electrically or optically sensing an alignment condition of alignment features of the second electronic circuit or assembly and alignment features of the first electronic circuit or assembly;
- during said sensing, obtaining and storing sensing information;
- and
- analyzing said sensing information to determine a movement to be caused between the second electronic circuit or assembly and the first electronic circuit or assembly to achieve an improved alignment condition;
- wherein at least one of the first electronic circuit or assembly and the second electronic circuit or assembly comprises a singulated integrated circuit.
Dependencies are inferred from the claim text.