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US 2011/0212307 A1Published application
Method to decrease warpage of a multi-layer substrate and structure thereof
AssigneePrinco Corp.
InventorChih-kuang Yang
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AssigneePrinco Corp.
InventorChih-kuang Yang
Estimating the term…
Disclosed is a method to decrease warpage of a multi-layer substrate, comprises a plurality of metal layers and a plurality of dielectric layers, which are alternately formed. A plane parallel with a first metal layer and a second metal layer of the plurality of metal layers substantially has the same distance between the first metal layer and the second metal layer respectively. The plane is defined as a central plane between the first metal layer and the second metal layer. A first total area covered by metal in the first metal layer is larger than a second area covered by metal in the second metal layer. At least one redundant metal is further set in same layer of the second metal layer. A second total area comprising a redundant metal area covered by the redundant metal and the second area is considerably equivalent to the first total area.
A multi-layer substrate structure, comprising a plurality of metal layers and a plurality of dielectric layers, which are alternately formed in the multi-layer substrate structure, and a plane parallel with a first metal layer and a second metal layer of the plurality of metal layers substantially has the same distance between the first metal layer and the second metal layer respectively, and the plane is defined as a central plane between the first metal layer and the second metal layer, wherein a first total area covered by metal in the first metal layer is larger than a second area covered by metal in the second metal layer, wherein at least one redundant metal is further set in same layer of the second metal layer, and a second total area comprising a redundant metal area covered by the redundant metal and the second area, is considerably equivalent to the first total area.
A multi-layer substrate structure, comprising a plurality of metal layers and a plurality of dielectric layers, which are alternately formed in the multi-layer substrate structure, and a plane parallel with a first metal layer and a second metal layer of the plurality of metal layers, and the plane is defined as a reference plane between the first metal layer and the second metal layer, wherein a first total area covered by metal in the first metal layer is larger than a second area covered by metal in the second metal layer, wherein at least one redundant metal is further set in same layer of the second metal layer, and a second total area comprising a redundant metal area covered by the redundant metal and the second area, is considerably equivalent to the first total area to form the second metal layer, the redundant metal and the first metal layer to be symmetrical with respect to the reference plane.
Dependencies are inferred from the claim text.