Method to decrease warpage of a multi-layer substrate and structure thereof

Abstract

Disclosed is a method to improve heat dissipation efficiency and to decrease warpage of a multi-layer substrate, comprising a plurality of metal layers and a plurality of dielectric layers, which are alternately formed. A plane parallel with a first metal layer and a second metal layer, substantially has the same distance between the first metal layer and the second metal layer respectively. The plane is defined as a central plane between the first metal layer and the second metal layer. A first total area covered by metal in the first metal layer is larger than a second area covered by metal in the second metal layer. At least one redundant metal is set in same layer of the second metal layer to make a second total area comprising a redundant metal area covered by the redundant metal and the second area considerably equivalent to the first total area.

Dependencies are inferred from the claim text.