Back to results
US 2011/0211323 A1Published application
Circuit board, semiconductor device, and method of manufacturing the semiconductor device
AssigneeKabushiki KaishaToshiba
InventorNorichika Unriin
Life of this patent
Estimating the term…
Abstract
According to one embodiment, a circuit board includes: a substrate on which circuit patterns are formed, a first surface of the substrate being formed substantially flat; and a solder resist film that covers the first surface of the substrate. The solder resist film assumes, as a whole, a convex shape in which the thickness of the solder resist film in the center of the substrate is larger than the thickness of the solder resist film in the periphery of the substrate.
Claims16
A semiconductor device comprising:
- a circuit board including:
- a substrate on which circuit patterns are formed, a first surface of the substrate being formed substantially flat;
- and
- a solder resist film that covers the first surface of the substrate;
- and
- a semiconductor chip provided on the solder resist film, wherein
- the solder resist film assumes, as a whole, a convex shape in which thickness of the solder resist film in a center of the substrate is larger than thickness of the solder resist film in a periphery of the substrate.
4 more elements
A circuit board comprising:
- a substrate on which circuit patterns are formed, a first surface of the substrate being formed substantially flat;
- and
- a solder resist film that covers the first surface of the substrate, wherein
- the solder resist film assumes, as a whole, a convex shape in which thickness of the solder resist film in a center of the substrate is larger than thickness of the solder resist film in a periphery of the substrate.
1 more element
A method of manufacturing a semiconductor device comprising:
- bringing a frame member, which comes into contact with a periphery of a substrate, into contact with a second surface on a rear side of a first surface of the substrate;
- decompressing an inner space of the frame member to recess the first surface side of the substrate;
- forming a solder resist film on the recessed first surface;
- stopping the decompression of the inner space of the frame member to restore the first surface side of the substrate to a substantially flat shape;
- and
- providing a semiconductor chip on the solder resist film.
3 more elements
Dependencies are inferred from the claim text.