Electronic device

Abstract

An electronic device includes a printed circuit board, conductive portions coated with a solder paste, a chip module installed on the printed circuit board, contact portions formed at the bottom of the chip module and corresponding to the conductive portions respectively, and at least one support portion formed between the chip module and the printed circuit board and having an end coupled to the printed circuit board and another end coupled to the contact portion of the chip module. When the chip module and printed circuit board are deformed in a high-temperature process, the contact portions will still be in contact with the solder paste. Since the printed circuit board is warped upward at the middle and downward at the periphery in a soldering process, the support portion maintains a specific distance between the two to prevent excessive melted solder pastes from flowing towards the periphery or causing short circuits.

Dependencies are inferred from the claim text.