Multilayer circuit board and method of manufacturing the same
AssigneeSumitomo Electric Industries, Ltd.
InventorAkira Oikawa
Life of this patent
Estimating the term…
Abstract
A multilayer circuit board (1) includes resin bases (101 to 10N) stacked while placing separators (121 to 12N−1) in between, interconnect patterns (111 to 11N) respectively formed on one surface of each of the resin bases (101 to 10N), and electro-conductive bumps (201 to 20N−1) which electrically connect the interconnect patterns (111 to 11N). The resin bases (101 to 10N) and the separators (121 to 12N−1) are heat-bonded, the separators (121 to 12N−1) are composed of a first thermoplastic resin material having a first glass transition temperature, and the resin bases (101 to 10N) are composed of a second thermoplastic resin material having a second glass transition temperature higher than the first glass transition temperature.
Claims20
A multilayer circuit board comprising:
- a plurality of resin bases stacked while respectively placing a separator in between;
- a plurality of interconnect patterns formed on one surface of each of said plurality of resin bases;
- and
- electro-conductive bumps which are formed to extend through said resin bases and said separators, so as to electrically connect said plurality of interconnect patterns,
- said resin bases and said separators being heat-bonded,
- said separators being composed of a first thermoplastic resin material having a first glass transition temperature, and
- each of said resin bases being composed of a second thermoplastic resin material having a second glass transition temperature higher than said first glass transition temperature.
A method of manufacturing a multilayer circuit board, comprising:
- forming, and thereby embedding, electro-conductive bumps respectively in (N−1) resin bases out of N resin bases (N is an integer of 2 or larger);
- forming an interconnect pattern respectively on one surface of each of said N resin bases;
- arranging said N resin bases by stacking them while respectively placing a separator in between, and while placing the resin base having no electro-conductive bumps, out of said N resin bases, outermostly;
- and
- electrically connecting said plurality of interconnect patterns through said electro-conductive bumps, by heat-bonding, and thereby integrating, of said N resin bases and said separators after said N resin bases are stacked while placing said separators in between,
- said separator being composed of a first thermoplastic resin material having a first glass transition temperature,
- each of said resin bases being composed of a second thermoplastic resin material having a second glass transition temperature higher than said first glass transition temperature, and
- in said heat-bonding of said N resin bases and said separators, said N resin bases and said separators are heat-bonded at a temperature higher than said first glass transition temperature, and lower than said second glass transition temperature.
Dependencies are inferred from the claim text.