High-density integrated circuit module structure
AssigneeWalton Advanced Engineeing Inc.
InventorYu Hong-Chi
Life of this patent
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Abstract
A high-density integrated circuit module structure comprises a substrate and a heat sink at least wherein the substrates form a reversely-staggered contacting stack structure by electrically contacting heat sinks and heat conductors on the heat sink have a non-flat structure at least to realize the present invention which extends the product's functions within an electronic product's restricted height and has a better vibration resistance capability, heat dissipation effect, and no steps involving junctions between solder balls and a carrier in an assembling procedure to simply an assembling procedure with improved functions, increased capacity, and reduced manufacturing costs.
Claims10
A high-density integrated circuit module structure, comprising:
- A substrate 20 at least has an inner surface 201 and an outer surface 202 with a plurality of outer pads 203 and a plurality of adapter pads 204 wherein the outer pads 203 electrically connect to the adapter pads 204 and the inner surface 201 of the substrate 20 is equipped with an electronic device 205 at least electrically connecting the outer pads 203 and the adapter pads 204;
- A heat sink 30 at least with a plurality of heat conductors 31 wherein the heat sink 30 is installed on end planes of the adapter pads 204 on the substrate 20 and the heat conductors 31 contact the adapter pads 204 and have a non-flat structure 311 at least;
- A substrate 20 has the outer pads 203 electrically contacting the adapter pads 204′ on another substrate 20′ by heat conductors 31 to construct the integrated circuit module with a reversely-staggered contacting high-density stack structure.
A high-density integrated circuit module structure, comprising:
- A substrate 20 at least has an inner surface 201 and an outer surface 202 with a plurality of outer pads 203 and a plurality of adapter pads 204 wherein the outer pads 203 electrically connect to the adapter pads 204 and the inner surface 201 of the substrate 20 is equipped with a first port 206 as well as an electronic device 205 at least which electrically connects to the outer pads 203 and the adapter pads 204;
- A heat sink 30 at least with a plurality of heat conductors 31 wherein the heat sink 30 is installed on end planes of the adapter pads 204 on the substrate 20, and the heat conductors 31 contact the adapter pads 204 and have a non-flat structure 311 at least;
- An extended substrate 40 at least has an inner surface 401 comprising a second port 402 and at least one electronic device 403 which electrically connects to the extended substrate 40;
- Wherein the outer pads 203 of a substrate 20 electrically contact the adapter pads 204′ on another substrate 20′ by the heat conductors 30 and the second port 402 of the extended substrate 40 mutually couples with the first port 206 of the substrate 20 for signal communication of an electrically connected integrated circuit module.
Dependencies are inferred from the claim text.