US 2011/0210760 A1 · PROBE AND METHOD FABRICATING THE SAME

Abstract

A probe and a method fabricating the same are disclosed. The probe includes a wire and a bump, wherein the wire is formed on a substrate; and the bump is formed upon the wire. In addition, a probe block is disclosed. The probe block includes a plurality of probes disposed on a substrate, so that the probe block is composed of a plurality of wires and bumps. The wires are disposed on the substrate and each bump is disposed accurately upon an end of each wire. The bump and the wire of the probe in accordance with the present invention are formed jointlessly. The method of fabricating the probe is characterized in that a grayscale mask is utilized to form the wire on the substrate and form the bump upon the wire by using a single masking process.

Claims10

Dependent claims

A probe fabrication method comprising:

forming a metal layer on a substrate;
forming a photoresist layer on the metal layer;
patterning the photoresist layer by using a grayscale mask to form a patterned circuit protection layer, the patterned circuit protection layer having a bump area and a lead area, and the bump area being thicker than the lead area;
and
etching the patterned circuit protection layer and the metal layer so that the metal layer is formed as a probe corresponding to the patterned circuit protection layer, wherein the metal layer is etched as a metal bump and a metal wire of the probe, the metal bump corresponding to the bump area and the metal wire corresponding to the lead area.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

12/780,886Filed 15 May 2010

Priority

TW 09910570226 Feb 2010

Published

1 Sep 2011

Term ends

Not estimatedThe source records don’t support an estimate.

Classification9 codes

H05K 3/4007
Forming printed elements for providing electric connections to or between printed circuits: surface contacts, e.g. bumps
G01R 1/07314
With individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or…:…
G01R 3/00
Apparatus or processes specially adapted for the manufacture or maintenance of measuring
H05K 3/0079
Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces: characterised by the method of…

Probe and method fabricating the same

Life of this patent

Probe and method fabricating the same

Life of this patent

Abstract

Claims10