High Frequency Power Supply Module Having High Efficiency and High Current

Abstract

A high frequency power supply module (200) of a synchronous Buck converter stacking the control FET (210) and sync FET (220) and having the driver IC (230) integrated in the final package solution. A QFN leadframe has a rectangular flat pad (201) destined to become the heat spreader of the package; the leads (202) are positioned in line with two opposite sides of the pad, the other pad sides being free of leads. The sync FET die (220) is soldered to the pad; a first clip (240), soldered on the sync die, has the control die (210) attached by solder. A second clip (260) is soldered on top of the control die. Also soldered on the same pad, yet not stacked with the other dies, is IC driver chip (230). The IC driver is wire bonded (233) to the pins of the package and to the stacked dies. All die attach and clip attach use the same solder material in order to be reflowed in the same reflow step.

Dependencies are inferred from the claim text.