Apparatus for molding electronic components
AssigneeAsm Technology Singapore Pte Ltd
InventorsShu Chuen HO, Si Liang LU, Swee Kwong MOK, Kar Weng YAN
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Abstract
A molding apparatus for an electronic device comprises a first mold chase, a second mold chase and a middle plate which is configured to be clamped together with the electronic device between the first mold chase and second mold chase during molding. A molding cavity formed in the middle plate is configured for receiving molding compound. A package pin is mounted on the middle plate to be movable with the middle plate, and a portion of the package pin is positioned to protrude into the molding cavity to form a mark in the molding compound when molding compound is molded around the said portion of the package pin.
Claims10
A molding apparatus for an electronic device, comprising:
- a first mold chase, a second mold chase and a middle plate which is configured to be clamped together with the electronic device between the first mold chase and second mold chase during molding;
- a molding cavity formed in the middle plate for receiving molding compound;
- and
- a package pin mounted on the middle plate and movable with the middle plate, a portion of the package pin being positioned to protrude into the molding cavity to form a mark in the molding compound when molding compound is molded around the said portion of the package pin.
A method of molding an electronic device, comprising the steps of:
- positioning the electronic device between a middle plate and a first mold chase of a molding apparatus;
- clamping the electronic device and middle plate between the first mold chase and a second mold chase;
- introducing molding compound into a molding cavity located in the middle plate, wherein the molding compound is molded around a portion of a package pin mounted on the middle plate which partially protrudes into the molding cavity;
- separating the second mold chase from the middle plate to remove cull while the package pin is fixedly secured to the middle plate;
- closing the second mold chase onto the middle plate;
- and thereafter
- separating the second mold chase and middle plate from the first mold chase, and removing the electronic device which has been molded.
A molding apparatus for an electronic device, comprising:
- a first mold chase, a second mold chase and a middle plate including a molding cavity which is configured to be clamped between the first mold chase and second mold chase during molding;
- at least one ejection pin extending from the first mold chase towards the bottom mold chase;
- at least one receiving hole in the middle plate which is sized to allow the ejection pin to pass through the middle plate to contact a molded electronic device positioned on the second mold chase;
- and
- a holding bush located at a base of the first mold chase through which the ejection pin is configured to pass;
- wherein the holding bush is at least partially insertable into the receiving hole for guiding the ejection pin precisely into the receiving hole.
Dependencies are inferred from the claim text.