Phase Separated Curable Compositions
AssigneeHenkel Corporation
InventorsAllison Yue Xiao, Yayun Liu
Life of this patent
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Abstract
A curable composition, suitable for underfill encapsulant, has two distinct phase domains after cure, a continuous phase and a discontinuous phase, in which one phase has a modulus value of 2 GPa or greater, and the second phase has a modulus value at least 1 Gpa less than the first phase, characterized in that the phases are generated in situ as the composition cures.
Claims10
A curable composition, which upon curing generates two phases in situ, the first phase after cure having a modulus value of 2 GPa or greater and the second phase after cure having a modulus value at least 1 Gpa less than the modulus value of the first phase after cure.
A curable composition comprising two or more components that polymerize independently, which upon curing form an interpenetrating polymer network, each polymerized component having a distinct and separate modulus from the other within the interpenetrating polymer network.
A cured composition comprising two phases generated in situ, in which the first phase has a modulus value of 2 GPa or greater and the second phase has a modulus value at least 1 GPa less than the modulus value of the first phase.
A cured composition generated in situ by the formation of an interpenetrating polymer network prepared from the combination of epoxy and maleimide resins, or the combination of epoxy and acrylate and/or methacrylate resins.
An assembly of a semiconductor and a substrate in which a gap existing between the semiconductor and the substrate is filled with a cured encapsulant composition comprising two phases or polymer networks, the first having a modulus value of 2 GPa or greater and the second having a modulus value at least 1 GPa less than the modulus value of the first, characterized in that the phases or networks were generated in situ as the encapsulant composition cured.
Dependencies are inferred from the claim text.