Back to results
US 2011/0210450 A1Published application
Semiconductor device with hollow structure
AssigneeInfineon Technologies AG
InventorsHorst Theuss, Gottfried Beer
Life of this patent
Estimating the term…
Abstract
A device comprising a chip, which is held in casting compound and on which a hollow structure is arranged is disclosed.
Claims15
1-12. (canceled)
An arrangement, comprising a number of chips which are held together in a casting compound and on which hollow structures are arranged.
23-32. (canceled)
A device, comprising:
- a chip, which is held in casting compound and on which a hollow structure is arranged, and a first electrically conductive layer, which has been applied at least in certain regions to the casting compound, wherein a plurality of hollow structures are arranged over an active area of the chip, and wherein a plurality of chips are held in casting compound.
35-37. (canceled)
Dependencies are inferred from the claim text.