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US 2011/0210445 A1Published application
Semiconductor device having via connecting between interconnects
AssigneePanasonic Corporation
InventorTakeshi HARADA
Life of this patent
Estimating the term…
Abstract
A first insulating film is provided between a lower interconnect and an upper interconnect. The lower interconnect and the upper interconnect are connected to each other by way of a via formed in the first insulating film. A dummy via or an insulating slit is formed on/in the upper interconnect near the via.
Claims49
1-26. (canceled)
A semiconductor device comprising:
- a first interconnect;
- a second interconnect formed over the first interconnect;
- a via electrically connecting between the first and second interconnects;
- and
- a dummy via electrically connected to the second interconnect,
- wherein the dummy via is made of a conductive film and is arranged so as to be incapable of having current flow therethrough.
3 more elements
Dependencies are inferred from the claim text.