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US 2011/0210438 A1Published application
Thermal Vias In An Integrated Circuit Package With An Embedded Die
AssigneeQUALCOMM Incorporated
InventorsFifin Sweeney, Milind P. Shah, Mario Francisco Velez, Damion B. Gastelum
Life of this patent
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Abstract
In a multi-module integrated circuit package having a package substrate and package contacts, a die is embedded in the package substrate with thermal vias that couple hotspots on the embedded die to some of the package contacts.
Claims17
An article of manufacture comprising:
- a package substrate comprising a plurality of package contacts;
- a die embedded in the package substrate;
- and
- a plurality of thermal vias in the package substrate coupling the die to at least one of the plurality of package contacts, wherein a thermal via belonging to the plurality of thermal vias has a cross-sectional shape substantially similar to a union of at least two overlapping circles.
1 more element
A method comprising:
- forming a hole in a package substrate core, the package substrate core having a first side with a first metal layer, and a second side with a second metal layer;
- placing a tape on the second side of the package substrate core;
- placing a die into the hole, the die having a first side and a second side proximal to the tape;
- forming a first substrate on the first side of the die, the first metal layer, and the first side of the package substrate core;
- and
- forming thermal vias in the first substrate to couple to the first side of the die at thermal hotspots of the die.
3 more elements
A method comprising:
- forming a hole in a package substrate core, the package substrate core having a first side with a first metal layer, and a second side with a second metal layer;
- placing a tape on the second side of the package substrate core;
- placing a die into the hole, the die having a first side and a second side proximal to the tape;
- forming a first substrate on the first side of the die, the first metal layer, and the first side of the package substrate core;
- removing the tape;
- forming a second substrate on the second side of the die, the second metal layer, and the second side of the package substrate core;
- and
- forming thermal vias in the second substrate to couple to the second side of the die at thermal hotspots of the die.
5 more elements
Dependencies are inferred from the claim text.