Integrated circuit packaging system with encapsulation and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsSeng Guan Chow, Hin Hwa Goh, Rui Huang, Heap Hoe Kuan
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a base integrated circuit on the base substrate; attaching a base barrier on the base substrate adjacent a base perimeter thereof; mounting a stack substrate over the base substrate, the stack substrate having a stack substrate aperture with the stack substrate having an inter-substrate connector thereon; and dispensing a connector underfill through the stack substrate aperture encapsulating the inter-substrate connector, overflow of the connector underfill prevented by the base barrier.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a base substrate;
- attaching a base integrated circuit on the base substrate;
- attaching a base barrier on the base substrate adjacent a base perimeter thereof;
- mounting a stack substrate over the base substrate, the stack substrate having a stack substrate aperture with the stack substrate having an inter-substrate connector thereon;
- and
- dispensing a connector underfill through the stack substrate aperture encapsulating the inter-substrate connector, overflow of the connector underfill prevented by the base barrier.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a base substrate;
- attaching a base integrated circuit on the base substrate;
- attaching a base barrier on the base substrate adjacent a base perimeter thereof;
- mounting a stack substrate over the base substrate, the stack substrate having a stack substrate aperture with the stack substrate having an inter-substrate connector thereon and the inter-substrate connector between the base barrier and the base integrated circuit;
- and
- dispensing a connector underfill through the stack substrate aperture encapsulating the inter-substrate connector, overflow of the connector underfill prevented by the base barrier.
An integrated circuit packaging system comprising:
- a base substrate;
- a base integrated circuit on the base substrate;
- a base barrier on the base substrate adjacent a base perimeter thereof;
- a stack substrate over the base substrate, the stack substrate having a stack substrate aperture with the stack substrate having an inter-substrate connector thereon;
- and
- a connector underfill through the stack substrate aperture encapsulating the inter-substrate connector, overflow of the connector underfill prevented by the base barrier.
Dependencies are inferred from the claim text.