Semiconductor chip and film and tab package comprising the chip and film

A film for a tape automated bonding (TAB) package comprising:

• an input terminal;
• an output terminal;
• a chip-mounting area for mounting over a surface of a chip that includes a first edge and a second edge that are substantially parallel to each other and are opposite each other on a respective first side and second side of the chip, the chip-mounting area including:
• an inner area and an outer area, wherein the outer area includes at least a first portion located between the inner area and a first outer border of the chip-mounted area that corresponds to the first edge, and at least a second portion located between the inner area and a second outer border of the chip-mounted area that corresponds to the second edge;
• a plurality of input leads extending from the first portion of the outer area of the chip-mounted area to the input terminal, the input leads arranged to connect to corresponding input pads of the chip;
• a plurality of first output leads extending from the second portion of the outer area of the chip-mounted area to the output terminal, the first output leads arranged to connect to corresponding first output pads of the chip;
• and
• a plurality of second output leads extending from the inner area of the chip-mounted area to the output terminal, the second output leads arranged to connect to corresponding second output pads of the chip;
• wherein at least part of at least a first of the plurality of second output leads extends from the inner area of the chip-mounted area in a direction toward the first edge.

A tape automated bonding (TAB) package comprising:

• a film;
• and
• a semiconductor chip, the semiconductor chip mounted on the film,
• wherein the semiconductor chip comprises:
• a connection surface including a first edge and a second edge that are substantially parallel to each other and are opposite each other on a respective first side and second side of the chip, and a third edge and fourth edge that are substantially perpendicular to the first and second edges, and are opposite each other on a respective third side and fourth side of the chip;
• a plurality of input pads adjacent the first edge and arranged in a first direction;
• a plurality of first output pads adjacent the second edge and arranged in the first direction;
• and
• a plurality of second output pads located between the plurality of input pads and the plurality of first output pads, and including at least first and second outermost pads located a certain distance from the respective third edge and fourth edge, and at least first and second inner pads located a greater distance from the respective third edge and fourth edge than the first and second outermost pads,
• wherein the film comprises:
• an input terminal and an output terminal;
• a chip-mounted area including an inner area and an outer area, wherein the outer area includes at least a first portion located between the inner area and a first outer border of the chip-mounted area that corresponds to the first edge, and at least a second portion located between the inner area and a second outer border of the chip-mounted area that corresponds to the second edge;
• a plurality of input leads extending from the first portion of the outer area of the chip-mounted area to the input terminal;
• a plurality of first output leads extending from the second portion of the outer area of the chip-mounted area to the output terminal;
• and
• a plurality of second output leads extending from the inner area of the chip-mounted area to the output terminal, and
• wherein:
• the plurality of input pads are connected respectively to the plurality of input leads;
• the plurality of first output pads are connected respectively to the plurality of first output leads;
• and
• the plurality of second output pads are connected respectively to the plurality of second output leads.