Semiconductor device and method of manufacturing the same
AssigneeKabushiki Kaisha Toshiba
InventorYoshiaki GOTO
Life of this patent
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Abstract
According to one embodiment, a semiconductor device includes: a lead group including a plurality of leads; a plurality of semiconductor memory chips stacked in a step shape on the lead group; and a resin mold section that seals the semiconductor memory chips. One end of a third lead and the other end of a second lead is connected by a metal wire for relay crossing over a first lead section included in the lead group. The metal wire for relay is provided in a space between the semiconductor memory chips stacked in the step shape and the lead group.
Claims19
A semiconductor device comprising:
- a lead group including a plurality of leads;
- a plurality of semiconductor memory chips stacked in a step shape on the lead group;
- and
- a resin mold section that seals the semiconductor memory chips, wherein
- the lead group includes:
- a first lead extending from an inside to an outside of the resin mold section;
- a second lead arranged on one side of the first lead on the inside of the resin mold section;
- and
- a third lead extending from the inside to the outside of the resin mold section and arranged on the other side of the first lead, wherein
- the semiconductor device further comprises:
- a first metal wire that electrically connects one end of the first lead and electrode pads of the semiconductor memory chips on the inside of the resin mold section;
- a second metal wire that electrically connect one end of the second lead and the electrode pads of the semiconductor memory chips on the inside of the resin mold section;
- and
- a metal wire for relay that electrically connects one end of the third lead and the other end of the second lead crossing over the first lead on the inside of the resin mold section, and
- the metal wire for relay is provided in a space between a part of the semiconductor memory chips stacked in the step shape and the lead group.
A method of manufacturing a semiconductor device comprising:
- stacking, in a step shape, a plurality of memory chips on a lead group including:
- a first lead extending from an inside to an outside of a resin mold section;
- a second lead arranged on one side of the first lead on the inside of the resin mold section;
- and a third lead extending from the inside to the outside of the resin mold section and arranged on the other side of the first lead;
- electrically connecting, using a first metal wire, one end of the first lead and electrode pads of the semiconductor memory chips;
- electrically connecting, using a second metal wire, one end of the second lead and the electrode pads of the semiconductor memory chips;
- and
- electrically connecting, using a metal wire for relay, one end of the third lead and the other end of the second lead crossing over the first lead, wherein
- the metal wire for relay is provided in a space between a part of the semiconductor memory chips stacked in the step shape and the lead group.
Dependencies are inferred from the claim text.