Semiconductor Substrate, Package and Device and Manufacturing Methods Thereof

A semiconductor package, comprising:

• a carrier having a first surface and a second surface opposite to the first surface, wherein the carrier further has a concave portion;
• a first conductive layer embedded in the first surface, forming a plurality of electro-isolated package traces;
• a second conductive layer embedded in the second surface and electrically connected to the first conductive layer;
• a semiconductor chip disposed in the concave portion;
• and
• a filling structure disposed in the concave portion for filling the gap between the semiconductor chip and the carrier.

A semiconductor device, comprising:

• a plurality of semiconductor substrates disposed layer by layer, wherein each of the semiconductor substrates comprises:
• a carrier having a first surface and a second surface opposite to the first surface, wherein the carrier further has a concave portion;
• a first conductive layer embedded in the first surface, forming a plurality of electro-isolated package traces;
• and
• a second conductive layer embedded in the second surface and electrically connected to the first conductive layer;
• and
• a plurality of adhesive layers disposed between the semiconductor substrates for combining the semiconductor substrates.

A manufacturing method of semiconductor substrate, comprising:

• providing a base layer;
• forming a first conductive layer on the base layer so as to form a plurality of electro-isolated package traces;
• forming a second conductive layer on the first conductive layer;
• forming a molding material layer for covering the first conductive layer and the second conductive layer;
• forming a concave portion on the molding material layer and exposing the second conductive layer so as to form a carrier;
• and
• removing the base layer.

A manufacturing method of semiconductor package, comprising:

• providing a base layer;
• forming a first conductive layer on the base layer so as to form a plurality of electro-isolated package traces;
• forming a second conductive layer on the first conductive layer;
• forming a molding material layer for covering the first conductive layer and the second conductive layer;
• forming a concave portion on the molding material layer and exposing the second conductive layer so as to form a carrier;
• removing the base layer;
• disposing a semiconductor chip in the concave portion;
• and
• forming a filling structure in the concave portion for filling the gap between the semiconductor and the carrier.

A manufacturing method of semiconductor device, comprising:

• providing a plurality of semiconductor substrates, wherein each of the semiconductor substrates comprises a carrier, a first conductive layer and a second conductive layer, the carrier has a concave portion, the first conductive layer is embedded in a first surface of the carrier, and the second conductive layer is embedded in a second surface of the carrier opposite to the first surface;
• providing a plurality adhesive layers between the semiconductor substrates;
• and
• combining the semiconductor substrates by bonding the adhesive layers.