Method for producing a semiconductor component, semiconductor component and intermediate product in the production thereof
OwnerBernd Bitnar, Holger Neuhaus +1inventors
InventorsBernd Bitnar, Holger Neuhaus, Andreas Krause
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Abstract
Method for producing semiconductor components with a contact structure having a high aspect ratio comprising the following steps: providing an essentially plane semiconductor substrate having a first side and a second side, applying a mask onto at least a first partial area on at least one of the sides of the semiconductor substrate and applying a contact structure onto at least a second partial area, which is different from first partial area, on at least one of the sides of semiconductor substrate.
Claims20
A method for producing semiconductor components, the method comprising the following steps:
- providing an essentially plane semiconductor substrate having a first side and a second side lying opposite thereto;
- applying a mask onto at least a first partial area on at least one of the sides of the semiconductor substrate;
- applying a contact structure with a height H onto at least a second partial area on at least one of the sides of the semiconductor substrate.
A semiconductor component comprising:
- a semiconductor substrate having a first side and a second side lying opposite thereto;
- and
- a contact structure applied onto at least one of the sides of the semiconductor substrate.
Dependencies are inferred from the claim text.