Infrared sensor
AssigneeRohm Co., Ltd.
InventorGoro Nakatani
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Abstract
An infrared sensor according to the present invention includes a semiconductor substrate, a thin-film pyroelectric element made of lead titanate zirconate and disposed on the semiconductor substrate, a coating film coating the pyroelectric element and having a topmost surface that forms a light receiving surface for infrared rays, and a cavity formed to a shape dug in from a top surface of the semiconductor substrate at a portion opposite to the pyroelectric element and thermally isolates the pyroelectric element from the semiconductor substrate.
Claims27
An infrared sensor comprising:
- a semiconductor substrate;
- a thin-film pyroelectric element made of lead titanate zirconate and disposed on the semiconductor substrate;
- a coating film coating the pyroelectric element and having a topmost surface forming a light receiving surface for infrared rays;
- and
- a cavity formed to a shape dug in from a top surface of the semiconductor substrate at a portion opposite to the pyroelectric element and thermally isolating the pyroelectric element from the semiconductor substrate.
A method for manufacturing an infrared sensor comprising:
- a step of forming an active element in a semiconductor substrate;
- a step of forming an interlayer insulating film on the semiconductor substrate
- a step of forming a contact so as to penetrate through the interlayer insulating film in a thickness direction thereof and so as to be electrically connected to the active element;
- a step of forming a thin-film pyroelectric element made of lead titanate zirconate on the interlayer insulating film by a sol-gel method;
- a step of coating the pyroelectric element with a coating film on the interlayer insulating film, after forming of the pyroelectric element;
- and
- a step of forming wirings, so as to be electrically connected to the active element and the pyroelectric element, respectively, on the coating film.
A sensor device comprising:
- a silicon substrate;
- a transistor formed on the silicon substrate;
- a pyroelectric element disposed on the silicon substrate;
- a cavity formed below the pyroelectric element in the silicon substrate.
A sensor device comprising:
- a silicon substrate;
- a transistor formed on the silicon substrate;
- a pyroelectric element disposed on the silicon substrate;
- a thermocouple disposed on the silicon substrate.
Dependencies are inferred from the claim text.