Ultra thin flip-chip backside device sensor package
AssigneeSound Design Technologies, Ltd.
InventorsSukhminder S. Binapal, David A. Roy
Life of this patent
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Abstract
An integrated circuit that senses a phenomenon, such as a magnetic field, may be mounted upside down on a carrier substrate so that the electrical connections to the integrated sensor circuit may be made on the side facing the carrier. This eliminates the need for wirebonds on the side of the sensor integrated circuit that faces the phenomenon being sensed, thereby substantially eliminating any uneven topography on that side. The sensor integrated circuit is able to sense the phenomenon by sensing it through the body of the sensor integrated circuit. The body of the sensor integrated circuit may have a thickness within a vicinity of fifty microns.
Claims20
A method of manufacturing a sensor package comprising:
- providing a carrier;
- provide a sensor integrated circuit having an active side on which a sensing circuit is built up and a non-active side opposite said active side, said sensing circuit adapted to sense a presence or absence of a phenomenon within a proximity to said sensing circuit;
- attaching said sensor integrated circuit to said carrier such that said active side faces said carrier and said inactive side faces away from said carrier;
- sensing the presence or absence of said phenomenon through said sensor integrated circuit.
A sensor package comprising:
- an integrated circuit having an active side and an inactive side;
- a sensor formed on said active side of said integrated circuit, said sensor adapted to detect a phenomenon;
- a carrier attached to said integrated circuit such that said active side of said circuit faces said carrier, whereby said sensor is able to detect said phenomenon when said phenomenon is present on said inactive side of said integrated circuit.
Dependencies are inferred from the claim text.