Double-faced adhesive film and electronic component module using same

A double-faced adhesive film comprising:

• a supporting film;
• a first adhesive layer laminated on one surface of the supporting film;
• and
• a second adhesive layer laminated on the other surface of the supporting film,
• wherein glass transition temperatures, after curing, of the first adhesive layer and the second adhesive layer are each 100° C. or lower, and
• the glass transition temperature, after curing, of the first adhesive layer is higher by 10° C. or more than the glass transition temperature, after curing, of the second adhesive layer;
• and
• the supporting film has a coefficient of linear expansion of 100 ppm or less.

A double-faced adhesive film comprising:

• a supporting film;
• and
• adhesive layers laminated respectively on both surfaces of the supporting film,
• wherein the adhesive layers are the layers capable of being formed by a method comprising steps of directly applying a varnish to the supporting film and drying the applied varnish, and
• flow magnitudes of the adhesive layers are each 0 to 2000 μm and the adhesive layers after curing each have a glass transition temperature of 100° C. or lower.

A double-faced adhesive film comprising:

• a supporting film;
• adhesive layers laminated respectively on both surfaces of the supporting film, and
• cover films laminated respectively on the surfaces, opposite to the supporting film, of the adhesive layers,
• wherein the double-faced adhesive film is used for the purpose of adhering a semiconductor element and/or a MEMS element to the substrate.