Back to results
US 2011/0210367 A1Published application
Light emitting diode packages, light emitting diode systems and methods of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorYuSik Kim
Life of this patent
Estimating the term…
Abstract
In a method of forming an LED semiconductor device, and in an LED semiconductor device, an LED is provided on a substrate. A first encapsulant material layer is provided on the LED, and the first encapsulant material layer is firstly annealed. A luminescence conversion material layer is provided on the firstly annealed first encapsulant material layer, and the first encapsulant material layer and the luminescence conversion material layer and secondly annealed.
Claims17
An LED semiconductor device comprising:
- an LED on a substrate;
- a first encapsulant material layer on the LED;
- and
- a luminescence conversion material layer consisting essentially of a luminescence conversion material on the first encapsulant material layer, the luminescence conversion material layer being of a thickness that is selected to determine a resultant transmittance of optical energy that is emitted from the LED.
1 more element
Dependencies are inferred from the claim text.