Optoelectronic Component and Method for the Production Thereof
AssigneeOSRAM Opto Semiconductors GmbH
InventorsStephan Kaiser, Andreas Ploessl
Life of this patent
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Abstract
A method of producing an optoelectronic component, comprising the method steps: A) providing a growth substrate (1); B) growing at least one semiconductor layer (2) epitaxially, to produce an operationally active zone; C) applying a metallic mirror layer (3) to the semiconductor layer (2); D) applying at least one contact layer (8) for electronic contacting of the component; E) detaching the growth substrate (1) from the semiconductor layer (2), so exposing a surface of the semiconductor layer (2); and F) structuring the semiconductor layer (2) by means of an etching method from the side of the surface which was exposed in method step E).
Claims13
A method of producing an opto electronic component, comprising the steps of:
- A) providing a growth substrate;
- B) growing at least one semiconductor layer epitaxially, to produce an operationally active zone;
- C) applying a metallic mirror layer to the semiconductor layer;
- D) applying at least one contact layer for electronic contacting of the component;
- E) detaching the growth substrate from the semiconductor layer, so exposing a surface of the semiconductor layer;
- and
- F) structuring the semiconductor layer by means of an etching method from the side of the surface which was exposed in method step E).
An optoelectronic component, comprising:
- a structured semiconductor layer;
- a metallic mirror layer arranged on the semiconductor layer;
- a diffusion barrier layer arranged on the metallic mirror layer;
- and
- a passivation layer arranged on the diffusion barrier layer;
- wherein the semiconductor layer comprises a mesa structure, the mesa trenches of which taper from the surface of the semiconductor layer towards the mirror layer.
Dependencies are inferred from the claim text.