Semiconductor package and fabrication method thereof
AssigneeAdvanced Optoelectronic Technology, Inc.
InventorCHIH-MING CHEN
Life of this patent
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Abstract
A light emitting element package includes a substrate, a reflection layer, at least one light emitting element, at least two conductive layers, a plurality of metal pins and an encapsulation layer. The reflection layer is formed on the substrate. The at least one light emitting element is mounted on the reflection layer on the substrate. The at least two conductive layers are electrically coupled to the at least one light emitting element. The metal pins electrically couple to the at least two conductive layers. The encapsulation layer is mounted on the substrate for encapsulating the at least one light emitting element.
Claims16
A fabrication method for a light emitting element package, the method comprising:
- providing a substrate defining a plurality of through holes therein;
- forming a plurality of metal pins in the through holes;
- forming a reflection layer on a surface of the substrate;
- mounting at least one light emitting element on the reflection layer on the substrate, the at least one light emitting element electrically connecting with the metal pins;
- and
- forming an encapsulation layer to encapsulate the light emitting elements.
A fabrication method for a light emitting element package, the method comprising:
- providing a substrate;
- defining a plurality of through holes in the substrate;
- forming a plurality of metal pins in the through holes;
- forming a reflection layer on a surface of the substrate;
- mounting at least one light emitting element on the reflection layer on the substrate, the at least one light emitting element being electrically connected with the metal pins;
- and
- forming an encapsulation layer to encapsulate the light emitting element.
A light emitting element package comprising:
- a substrate;
- a reflection layer formed on the substrate;
- at least one light emitting element mounted on the package substrate;
- at least two conductive layers electrically coupled to the at least one light emitting element;
- a plurality of metal pins electrically coupled to the at least two conductive layers;
- and
- an encapsulation layer mounted on the substrate for encapsulation the at least one light emitting element.
Dependencies are inferred from the claim text.