Semiconductor wafer
AssigneeLextar Electronics Corporation
InventorsFu-Bang CHEN, Kuo-Lung Fang, Kun-Fu Huang, Te-Chung Wang
Life of this patent
Estimating the term…
Abstract
A semiconductor wafer includes a substrate, a first separating structure and a semiconductor stacked layer structure. The substrate has a first surface. The first separating structure is formed on the first surface to divide the first surface into a plurality of independent regions. The minimum area of each of the regions is more than or equal to one square inch. The semiconductor stacked layer structure is disposed on the first surface and the first separating structure. The semiconductor wafer can prevent bowing of the semiconductor wafer during an epitaxial growth process so as to enhance quality of the semiconductor wafer.
Claims32
A semiconductor wafer, comprising:
- a substrate having a first surface;
- at least one first separating structure formed on the first surface to divide the first surface into a plurality of independent regions, the minimum area of each of the regions being more than or equal to one square inch;
- and
- a semiconductor stacked layer structure disposed on the first surface and the at least one first separating structure.
A semiconductor wafer, comprising:
- a substrate having a first surface;
- at least one first separating structure formed on the first surface, each first separating structure having two ends which are separated with each other, at least one of the two ends not extending to an edge of the first surface;
- and
- a semiconductor stacked layer structure disposed on the first surface and the at least one first separating structure.
A light-emitting diode, comprising:
- a substrate having a first surface;
- at least one first separating structure formed on the first surface to divide the first surface into a plurality of independent regions, the minimum area of each of the regions being more than or equal to one square inch;
- and
- a semiconductor stacked layer structure disposed on the first surface and the at least one first separating structure.
A light emitted diode, comprising:
- a substrate having a first surface;
- at least one first separating structure formed on the first surface, each first separating structure having two ends that are separated with each other, at least one of the two ends not extending to an edge of the first surface;
- and
- a semiconductor stacked layer structure disposed on the first surface and the at least one first separating structure.
A semiconductor wafer, comprising:
- a substrate having a first surface and a second surface;
- at least one first separating structure formed on the first surface to divide the first surface into a plurality of independent regions, the minimum area of each of the regions being more than or equal to one square inch;
- and
- a semiconductor stacked layer structure disposed on the second surface.
A semiconductor wafer, comprising:
- a substrate having a first surface and a second surface;
- at least one first separating structure formed on the first surface, each first separating structure having two ends that are separated with each other, at least one of the two ends not extending to an edge of the first surface;
- and
- a semiconductor stacked layer structure disposed on the second surface.
Dependencies are inferred from the claim text.