Apparatus and method for predetermined component placement to a target platform
AssigneeWintec Industries, Inc.
InventorKong C. Chen
Life of this patent
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Abstract
The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.
Claims29
An electronic circuit or assembly, comprising:
- a singulated integrated circuit;
- and
- a plurality of alignment features configured to allow for electrical or optical sensing of an alignment condition of the electronic circuit or assembly with another electronic circuit or assembly, each of the plurality of alignment features comprising a plurality of alignment elements arranged in a pattern.
An electronic assembly comprising:
- a first electronic circuit or assembly comprising electrical contacts and one or more alignment features;
- a second electronic circuit or assembly comprising electrical contacts and one or more alignment features;
- and
- a connecting structure electrically connecting electrical contacts of the second electronic circuit or assembly with electrical contacts of the first electronic circuit or assembly in a position such that the one or more alignment features of the second electronic circuit or assembly and the one or more alignment features of the first electronic circuit or assembly are aligned;
- wherein each of the one or more alignment features of the first electronic circuit or assembly and the one or more alignment features of the second electronic circuit or assembly comprises a plurality of alignment elements arranged in a pattern;
- and
- wherein at least one of the first electronic circuit or assembly and the second electronic circuit or assembly comprises a singulated integrated circuit.
A method of testing a combination of a first electronic circuit or assembly coupled with one or more additional electronic circuits or assemblies, comprising:
- providing the electronic circuit or assembly and the one or more additional electronic circuits or assemblies with alignment features the alignment features being configured such that proper alignment causes each alignment feature of an electronic circuit or assembly to be in contact or near contact with an alignment feature of another electronic circuit or assembly;
- providing a signal path chain connecting a plurality of alignment features;
- applying an electrical stimulus to one end of the signal path chain;
- and
- sensing presence or absence of the electrical stimulus at another end or terminus of the signal path chain.
A product produced by a process comprising:
- placing electrical contacts of a second electronic circuit or assembly in contact or near contact with electrical contacts of a first electronic circuit or assembly;
- during said contact or near contact, electrically or optically sensing an alignment condition of alignment features of the second electronic circuit or assembly and alignment features of the first electronic circuit or assembly;
- during said sensing, obtaining and storing sensing information;
- and
- analyzing said sensing information to determine a movement to be caused between the second electronic circuit or assembly and the first electronic circuit or assembly to achieve an improved alignment condition;
- wherein at least one of the first electronic circuit or assembly and the second electronic circuit or assembly comprises a singulated integrated circuit.
Dependencies are inferred from the claim text.