Sputtering apparatus, sputtering method, and electronic device manufacturing method
AssigneeCanon Anelva Corporation
InventorsToru Kitada, Naoki Watanabe, Motonobu Nagai
Life of this patent
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Abstract
A sputtering apparatus includes a substrate holder which holds a substrate to be rotatable in the plane direction of the processing surface of the substrate, a substrate-side magnet which is arranged around the substrate and forms a magnetic field on the processing surface of the substrate, a cathode which is arranged diagonally above the substrate and receives discharge power, a position detection unit which detects the rotational position of the substrate, and a controller which controls the discharge power in accordance with the rotational position detected by the position detection unit.
Claims19
A sputtering apparatus comprising:
- a substrate holder which holds a substrate to be rotatable in a plane direction of a processing surface of the substrate;
- substrate magnetic field forming means, arranged around the substrate, for forming a magnetic field on the processing surface of the substrate;
- a cathode which is arranged at a position diagonally opposing the substrate and receives discharge power;
- position detection means for detecting a rotational position of the substrate;
- and
- power control means for controlling power applied to said cathode in accordance with the rotational position detected by said position detection means.
A sputtering method comprising executing film deposition by applying, to a cathode arranged at a position diagonally opposing a substrate, power adjusted in accordance with a rotational position of the substrate that is detected by position detection means, while rotating the substrate in a plane direction of a processing surface of the substrate and forming a magnetic field on the processing surface.
An electronic device manufacturing method comprising a film deposition step of depositing a film by a sputtering method by applying, to a cathode arranged at a position diagonally opposing a substrate, power adjusted in accordance with a rotational position of the substrate that is detected by position detection means, while rotating the substrate in a plane direction of a processing surface of the substrate and forming a magnetic field on the processing surface.
A sputtering method comprising executing film deposition by co-sputtering by applying, to a plurality of cathodes which are arranged at positions diagonally opposing a substrate and hold targets formed from different materials, power adjusted in accordance with a rotational position of the substrate that is detected by position detection means, while rotating the substrate in a plane direction of a processing surface of the substrate and forming a magnetic field on the processing surface.
An electronic device manufacturing method comprising a film deposition step of executing film deposition by co-sputtering by applying, to a plurality of cathodes which are arranged at positions diagonally opposing a substrate and hold targets formed from different materials, power adjusted in accordance with a rotational position of the substrate that is detected by position detection means, while rotating the substrate in a plane direction of a processing surface of the substrate and forming a magnetic field on the processing surface.
Dependencies are inferred from the claim text.