Physical Vapor Deposition With Heat Diffuser
AssigneeFUJIFILM Corporation
InventorsYouming Li, Jeffrey Birkmeyer
Life of this patent
Estimating the term…
Abstract
A physical vapor deposition apparatus includes a vacuum chamber having side walls, a cathode inside the vacuum chamber, wherein the cathode is configured to include a sputtering target, a radio frequency power supply configured to apply power to the cathode, an anode inside and electrically connected to the side walls of the vacuum chamber, and a chuck inside and electrically isolated from the side walls of the vacuum chamber, the chuck configured to support a substrate, and a heater to heat the substrate supported on the chuck. The chuck includes a body and a graphite heat diffuser supported on the body and configured to contact the substrate.
Claims27
A physical vapor deposition apparatus comprising:
- a vacuum chamber having side walls;
- a cathode inside the vacuum chamber, wherein the cathode is configured to include a sputtering target;
- a radio frequency power supply configured to apply power to the cathode;
- an anode inside and electrically connected to the side walls of the vacuum chamber;
- a chuck inside and electrically isolated from the side walls of the vacuum chamber, the chuck configured to support a substrate;
- and
- a heater to heat the substrate supported on the chuck,
- wherein the chuck comprises a body and a graphite heat diffuser supported on the body and configured to contact the substrate.
A method of physical vapor deposition comprising:
- applying a radio frequency signal to a cathode in a physical vapor deposition apparatus, wherein the cathode includes a sputtering target;
- supporting a substrate on a chuck;
- contacting the substrate to a graphite heat diffuser located between the chuck and the substrate while heating the substrate;
- and
- depositing a material from the sputtering target onto the substrate.
Dependencies are inferred from the claim text.